COMPARATIVE CALORIMETRIC STUDY OF EPOXY CURE BY MICROWAVE VS THERMAL-ENERGY

被引：72

作者：

MIJOVIC, J

WIJAYA, J

机构：

[1] Chemical Engineering Department, Polytechnic University, NY-11201, 333 Jay Street, Brooklyn

来源：

MACROMOLECULES | 1990年 / 23卷 / 15期

关键词：

D O I：

10.1021/ma00217a021

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

An investigation was carried out into the kinetics of cure of an epoxy formulation by microwave versus thermal energy. The formulation consisted of a diglycidyl ether of bisphenol A (DGEBA) type epoxy resin and diaminodiphenyl sulfone (DDS) curing agent. Differential scanning calorimetry (DSC) was used to measure and compare the degree of cure (α) and the glass transition (Tg) of samples cured at the same temperature in microwave and thermal fields. A description of the microwave circuit is given. It was found that in the temperature interval used in this study (155-195 °C), cure proceeded slightly faster in thermal than in microwave field. Also, a broader glass transition range was observed in microwave-cured samples, suggesting a possible difference in the mechanism of cure in thermal and microwave fields. © 1990, American Chemical Society. All rights reserved.

引用

页码：3671 / 3674

页数：4

共 19 条

[1] STRUCTURE OF A TYPICAL AMINE-CURED EPOXY RESIN [J].