EFFECTS OF GOLD AND NICKEL PLATING THICKNESSES ON STRENGTH AND RELIABILITY OF THERMOCOMPRESSION-BONDED EXTERNAL LEADS

被引:6
作者
PANOUSIS, NT [1 ]
HALL, PM [1 ]
机构
[1] BELL TEL LABS INC,ALLENTOWN,PA 18103
来源
IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING | 1976年 / 12卷 / 04期
关键词
D O I
10.1109/TPHP.1976.1135158
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:282 / 288
页数:7
相关论文
共 7 条
[1]  
CADY JR, 1973, PLATING, V60, P139
[2]  
Deuber J. M., 1973, Plating, V60, P715
[3]   STRENGTH OF GOLD-PLATED COPPER LEADS ON THIN-FILM CIRCUITS UNDER ACCELERATED AGING [J].
HALL, PM ;
PANOUSIS, NT ;
MENZEL, PR .
IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1975, 11 (03) :202-205
[4]  
HALL PM, IN PRESS
[5]  
JOHNSON DR, 1973, 4TH PLAT EL IND S AM, P272
[6]  
PANOUSIS NT, UNPUBLISHED
[7]  
PANOUSIS NT, TO BE PUBLISHED