IMPROVED ULTRATHIN OXYNITRIDE FORMED BY THERMAL NITRIDATION AND LOW-PRESSURE CHEMICAL VAPOR-DEPOSITION PROCESS

In this letter, we will present the electrical and reliability characteristics of ultrathin oxynitrides (65-73 angstrom) formed by thermal nitridation of silicon substrate followed by deposition of silicon dioxide by low pressure chemical vapor deposition (LPCVD) technique. The dielectric integrity has been compared to those of the conventional thermal oxide and reoxidized nitrided oxides. It has been found that the new oxynitrides have lower electron trapping, higher charge-to-breakdown, and lower interface state generation under electrical stress even in comparison to reoxidized nitrided oxides with the same thermal budget. The improved characteristics are believed to be due to the combination of the nitrogen-rich layer at the Si/SiO2 interface, the higher quality of LPCVD oxides over thermally grown oxides, and the reduced hydrogen concentration in the dielectrics in comparison to conventional nitrided oxides. The results indicate that these new oxynitride films may be promising for ultra large scale integrated metal-oxide-semiconductor device applications, especially in cases where low thermal budget processes are desirable.