MULTICHIP ASSEMBLY WITH FLIPPED INTEGRATED-CIRCUITS

被引:8
作者
HEINEN, KG
SCHROEN, WH
EDWARDS, DR
WILSON, AM
STIERMAN, RJ
LAMSON, MA
机构
来源
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1989年 / 12卷 / 04期
关键词
D O I
10.1109/33.49029
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页码:650 / 657
页数:8
相关论文
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