CONTACT-ANGLE AND WORK OF ADHESION ISOTHERMS OF SILICON-TIN ALLOYS ON MONOCRYSTALLINE SILICON-CARBIDE

被引：7

作者：

LI, JG

HAUSNER, H

机构：

[1] Institut für Nichtmetallische Werkstoffe, Technische Universität Berlin, 1000 Berlin 12

来源：

MATERIALS LETTERS | 1991年 / 11卷 / 10-12期

关键词：

D O I：

10.1016/0167-577X(91)90133-Q

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The contact angle and work of adhesion of binary silicon-tin alloys on monocrystalline alpha-silicon carbide have been determined at 1703 K using the "sessile drop" method. It has been found that the contact angle decreases when silicon is added to tin and vice versa, with a minimum value at chi-Si = 0.2. The work of adhesion is found to increase when silicon is added to tin but to decrease when tin is added to silicon. These results are explained by the fact that silicon is surface active at the Sn/SiC interface, while tin is surface active at the silicon surface.

引用

页码：355 / 357

页数：3