INITIAL STUDY ON COPPER CMP SLURRY CHEMISTRIES

被引：126

作者：

CARPIO, R

FARKAS, J

JAIRATH, R

机构：

[1] SEMATECH, Austin, TX 78741

来源：

THIN SOLID FILMS | 1995年 / 266卷 / 02期

关键词：

COPPER; POLISHING;

D O I：

10.1016/0040-6090(95)06649-7

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Chemical mechanical polishing (CMP) of copper has been investigated with suspended silica and alumina abrasives using various slurry chemistries. The characteristics of these chemistries were studied by electrochemical d.c. polarization and a.c. impedance measurements. Problems and directions related to the formulation of copper CMP slurries are discussed.

引用

页码：238 / 244

页数：7

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