MECHANISM OF PHOTORESIST RESOLUTION IMPROVEMENT BY PREEXPOSURE TREATMENT

被引:5
作者
ASAUMI, S
NAKANE, H
机构
[1] Tokyo Ohka Kogyo Company, Limited, Gotemba-shi, Shizuoka-ken 412
关键词
Phenolic Resins--Dissolution - Surface Treatment--Chemical Reactions;
D O I
10.1149/1.2086986
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
This paper discusses an insoluble layer which forms on the photoresist surface by pre-exposure treatment. From an analytical result of used developer for pre-exposure treatment, we have found that TBP-NQD triester (triester of trihy-droxybenzophenone with naphthoquinone-1,2-diazide-5-sulfonic acid) and high molecular weight portion of Novolak resin in the positive photoresist were insoluble in the developer. We presume that those components are forming insoluble layer on the photoresist surface. © 1990, The Electrochemical Society, Inc. All rights reserved.
引用
收藏
页码:2546 / 2549
页数:4
相关论文
共 3 条
  • [1] DEFOREST WS, 1975, PHOTORESIST MATERIAL, pCH2
  • [2] Koshiba M., 1988, Proceedings of the SPIE - The International Society for Optical Engineering, V920, P364, DOI 10.1117/12.968337
  • [3] NAGASWAMI V, 1982, J ELECTROCHEM SOC, V131, P1369