POWER-LAW CREEP DIAGRAM OF GAMMA-TI-53AL INTERMETALLICS

被引：11

作者：

HAMADA, N

ISHIKAWA, Y

MAYRUYAMA, K

OIKAWA, H

机构：

[1] Department of Materials Science, Tohoku University, Sendai

来源：

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 1995年 / 192卷

关键词：

CREEP; TITANIUM; ALUMINUM; INTERMETALLICS;

D O I：

10.1016/0921-5093(94)03292-0

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The temperature and stress dependence of the minimum creep rate in polycrystalline Ti-53.0mol%Al intermetallics was investigated over a wide range of conditions. Three types were observed and the activation energy and stress exponent were determined for each type. The regions where these three types can be observed were mapped on log epsilon-log sigma and log epsilon-1/T coordinates for creep of polycrystalline Ti-53Al intermetallics.

引用

页码：716 / 721

页数：6

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