CONCURRENT THERMAL DESIGNS OF PCBS - BALANCING ACCURACY WITH TIME CONSTRAINTS

被引：16

作者：

NIGEN, JS ^{[1
]}

AMON, CH ^{[1
]}

机构：

[1] CARNEGIE MELLON UNIV, ENGN DESIGN RES CTR, PITTSBURGH, PA 15213 USA

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1992年 / 15卷 / 05期

关键词：

D O I：

10.1109/33.180051

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A thermal design methodology suitable for concurrent design of cost-driven electronic systems is proposed and exemplified for a sample printed circuit board (PCB). The design methodology utilizes an evolutionary concept, in which the analysis tools are capable of adjusting their level of complexity as the design evolves, initiating with rough approximate analyses and culminating in a conjugate conduction/convection simulation for a portion of the sample board. The level of approximation included at each stage of the design is selected with consideration of both time and accuracy constraints. Furthermore, the importance of considering the conjugate problem in generating heat transfer correlations for electronic packages is discussed.

引用

页码：850 / 859

页数：10

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