COOLING CHARACTERISTICS OF DIAMOND-SHAPED INTERRUPTED COOLING FIN FOR HIGH-POWER LSI DEVICES

被引:57
作者
KISHIMOTO, T
SASAKI, S
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D O I
10.1049/el:19870328
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
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页码:456 / 457
页数:2
相关论文
共 3 条
[1]  
PATANKAR SV, 1972, 14TH S INT COMB, P605
[2]   OPTIMAL STRUCTURE FOR MICROGROOVED COOLING FIN FOR HIGH-POWER LSI DEVICES [J].
SASAKI, S ;
KISHIMOTO, T .
ELECTRONICS LETTERS, 1986, 22 (25) :1332-1334
[3]  
TUCKERMAN DB, 1981, IEEE ELECTR DEVICE L, V1, P126