机构:Hitachi Ltd, Hitachi Research Lab,, Hitachi, Jpn, Hitachi Ltd, Hitachi Research Lab, Hitachi, Jpn
YAMADA, K
NISHIHARA, M
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机构:Hitachi Ltd, Hitachi Research Lab,, Hitachi, Jpn, Hitachi Ltd, Hitachi Research Lab, Hitachi, Jpn
NISHIHARA, M
KANZAWA, R
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机构:Hitachi Ltd, Hitachi Research Lab,, Hitachi, Jpn, Hitachi Ltd, Hitachi Research Lab, Hitachi, Jpn
KANZAWA, R
KOBAYASHI, R
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机构:Hitachi Ltd, Hitachi Research Lab,, Hitachi, Jpn, Hitachi Ltd, Hitachi Research Lab, Hitachi, Jpn
KOBAYASHI, R
机构:
[1] Hitachi Ltd, Hitachi Research Lab,, Hitachi, Jpn, Hitachi Ltd, Hitachi Research Lab, Hitachi, Jpn
来源:
SENSORS AND ACTUATORS
|
1983年
/
4卷
/
01期
关键词:
CONTROL;
ELECTRIC VARIABLES - Voltage - INTEGRATED CIRCUITS - Applications - PIEZOELECTRIC DEVICES - Thermal Effects;
D O I:
10.1016/0250-6874(83)85009-4
中图分类号:
O65 [分析化学];
学科分类号:
070302 ;
081704 ;
摘要:
A silicon piezoresistive integrated pressure sensor (IPS) containing sensing, temperature compensation and amplification circuits has been developed for automotive and industrial applications, etc. The chip of the IPS is bonded on a silicon support 2 mm thick, using an electrostatic bonding technique for reducing unwanted thermal stress from the support and package. Temperature invariant and laser trimmable printed thick film resistors for adjusting temperature compensation and transfer function scaling are formed on the ceramic plate around the IPS chip, which is then mounted in a modified TO-3 package as a three terminal device. Experimental results and simulations of span temperature compensation in the sensing element bridge and the fully assembled IPS are shown here to be in good agreement. The temperature dependence of the zero and non-linearity of the IPS are also described.