COLLIMATED SPUTTER-DEPOSITION, A NOVEL METHOD FOR LARGE-AREA DEPOSITION OF SPINDT TYPE FIELD-EMISSION TIPS
被引:16
作者:
VANVEEN, GNA
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机构:Philips Research Lab, Eindhoven
VANVEEN, GNA
THEUNISSEN, B
论文数: 0引用数: 0
h-index: 0
机构:Philips Research Lab, Eindhoven
THEUNISSEN, B
VANDEHEUVEL, K
论文数: 0引用数: 0
h-index: 0
机构:Philips Research Lab, Eindhoven
VANDEHEUVEL, K
HORNE, R
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h-index: 0
机构:Philips Research Lab, Eindhoven
HORNE, R
BURGMANS, ALJ
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h-index: 0
机构:Philips Research Lab, Eindhoven
BURGMANS, ALJ
机构:
[1] Philips Research Lab, Eindhoven
来源:
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
|
1995年
/
13卷
/
02期
关键词:
D O I:
10.1116/1.588337
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
A new technique has been developed to manufacture Spindt-type field emission (FE) cathodes. It is called collimated sputter deposition (CSD). A standard sputter deposition machine can be utilized to which a direction selecting filter is added. The particles passing the collimator are incident on the integrated field emission structure. As a result the holes in the gate are closed and tips are formed. A number of collimator configurations has been considered. The influence of the dominating process parameters is investigated. Several tip materials have been tested. FE results on tips manufactured by means of CSD are presented.