Thermal stability of nanocrystalline Ni

被引：228

作者：

Klement, U ^{[1
]}

Erb, U ^{[1
]}

ElSherik, AM ^{[1
]}

Aust, KT ^{[1
]}

机构：

[1] QUEENS UNIV, DEPT MAT & MET ENGN, KINGSTON, ON K7L 3N6, CANADA

来源：

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 1995年 / 203卷 / 1-2期

基金：

加拿大自然科学与工程研究理事会;

关键词：

thermal stability; nickel; grain growth; microstructure;

D O I：

10.1016/0921-5093(95)09864-X

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Thermal stability of electroplated nanocrystalline Ni of 10 and 20 nm grain size was investigated by differential scanning calorimetry (DSC). The temperature dependence and heat release Delta H during grain growth have been determined by linear anisothermal measurements (linear heating at 10 K min(-1)). The corresponding change in microstructure has been monitored in the temperature range between 373 K and 693 K using transmission electron microscopy (TEM). The TEM and DSC studies identified three exothermic reactions: ''nucleation'' and abnormal grain growth (353-562 K), normal grain growth (562-593 K) and growth towards equilibrium (643-773 K). The grain growth behaviour, and the similar heat releases Delta H = 18 J g(-1) and 16 J g(-1) measured for the 10 nm and 20 nm Ni nanocrystals respectively in the DSC experiments may be related to the observed sulphur segregation at grain boundaries and triple junctions.

引用

页码：177 / 186

页数：10

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