RECOVERY OF ELECTRICAL RESISTIVITY OF COPPER SILVER + GOLD AFTER SMALL PLASTIC DEFORMATIONS AT - 195DEGREESC

被引:7
作者
DAWSON, HI
机构
来源
ACTA METALLURGICA | 1964年 / 12卷 / 01期
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D O I
10.1016/0001-6160(64)90064-1
中图分类号
TF [冶金工业];
学科分类号
0806 ;
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页码:113 / &
相关论文
共 9 条
[1]   THE RELATION BETWEEN THE ELECTRICAL RESISTIVITY AND THE YIELD STRENGTH OF DEFORMED COPPER [J].
BERGHOUT, CW .
ACTA METALLURGICA, 1956, 4 (02) :211-213
[2]  
BERGHOUT CW, 1956, THESIS DELFT
[3]   DIFFUSION OF SINGLE VACANCIES AND DIVACANCIES IN QUENCHED GOLD [J].
DEJONG, M ;
KOEHLER, JS .
PHYSICAL REVIEW, 1963, 129 (01) :40-&
[4]   THE INFLUENCE OF LATTICE DEFECTS ON THE ELECTRICAL RESISTIVITY OF A GOLD-COPPER ALLOY (7-AT-PERCENT CU) [J].
KOREVAAR, BM .
ACTA METALLURGICA, 1958, 6 (09) :572-579
[5]  
KOREVAAR BM, 1960, THESIS DELFT
[6]  
MANINTVELD JA, 1954, THESIS DELFT
[7]   UNTERSUCHUNG ATOMARER FEHLSTELLEN IN VERFORMTEM UND ABGESCHRECKTEM SILBER [J].
RAMSTEINER, F ;
SCHULE, W ;
SEEGER, A .
PHYSICA STATUS SOLIDI, 1962, 2 (08) :1005-1020
[8]   POINT DEFECTS IN GOLD [J].
SCHULE, W ;
SEEGER, A ;
SCHUMACHER, D ;
KING, K .
PHYSICA STATUS SOLIDI, 1962, 2 (09) :1199-1220
[9]  
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