TEMPERATURE-RAMP RESISTANCE ANALYSIS TO CHARACTERIZE ELECTROMIGRATION

被引：31

作者：

PASCO, RW ^{[1
]}

SCHWARZ, JA ^{[1
]}

机构：

[1] SYRACUSE UNIV,DEPT CHEM ENGN & MAT SCI,SYRACUSE,NY 13210

来源：

关键词：

D O I：

10.1016/0038-1101(83)90101-6

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：445 / 452

页数：8

共 19 条

[1] DEVIATIONS FROM MATTHIESSENS RULE
BASS, J
[J]. ADVANCES IN PHYSICS, 1972, 21 (91) : 431 - &
[2] QUENCHING VACANCIES IN ALUMINIUM
BRADSHAW, FJ
PEARSON, S
[J]. PHILOSOPHICAL MAGAZINE, 1957, 2 (16): : 570 - 571
[3] d'Heurle F. M., 1978, Thin films. Interdiffusion and reactions, P243
[4] KINETICS OF VACANCY MOTION IN HIGH-PURITY ALUMINUM
DESORBO, W
TURNBULL, D
[J]. PHYSICAL REVIEW, 1959, 115 (03): : 560 - 563
[5] QUENCHING OF IMPERFECTIONS IN ALUMINUM
DESORBO, W
TURNBULL, D
[J]. ACTA METALLURGICA, 1959, 7 (02): : 83 - 85
[6] EFFECT OF COPPER ADDITIONS ON ELECTROMIGRATION IN ALUMINUM THIN FILMS
DHEURLE, FM
[J]. METALLURGICAL TRANSACTIONS, 1971, 2 (03): : 683 - &
[7] FISCHER F, 1977, P IEEE ANN RELIABILI, P250
[8] GHATE PB, 1980, RADCTR80328 ROM AIR
[9] ACTIVATION-ENERGY FOR ELECTROTRANSPORT IN THIN ALUMINUM FILMS BY RESISTANCE MEASUREMENTS
HUMMEL, RE
DEHOFF, RT
GEIER, HJ
[J]. JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 1976, 37 (01) : 73 - 80
[10] HUMMEL RE, 1977, ELECTRO THERMOTRANSP, P108