LASER-DRIVEN MICRO-EXPLOSIVE BONDING OF ALUMINUM FILMS TO COPPER AND SILICON

被引：12

作者：

ALEXANDER, DE ^{[1
]}

WAS, GS ^{[1
]}

MAYER, FJ ^{[1
]}

机构：

[1] KMS FUS,ANN ARBOR,MI 48104

来源：

JOURNAL OF MATERIALS SCIENCE | 1988年 / 23卷 / 06期

关键词：

D O I：

10.1007/BF01115786

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：2181 / 2186

页数：6

共 15 条

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[7]

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[8]

HONGO M, 1980, Patent No. 4190759

[9]

LANE TJ, 1984, IBM TECH DISCLOSURE, V27, P446

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MAYER, FJ ;

BUSCH, GE .

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