SELF-ASSEMBLY OF 3-DIMENSIONAL MICROSTRUCTURES USING ROTATION BY SURFACE-TENSION FORCES

被引：80

作者：

SYMS, RRA

YEATMAN, EM

机构：

[1] Optical and Semiconductor Devices Section, Department of Electrical and Electronic Engineering, Imperial College of Science, Technology and Medicine, London SW7 2BT, Exhibition Road

来源：

ELECTRONICS LETTERS | 1993年 / 29卷 / 08期

关键词：

MICROSTRUCTURES; NANOTECHNOLOGY;

D O I：

10.1049/el:19930444

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The authors propose that automatic, parallel and self-limiting operations can be performed to structures into full three-dimensional geometries, using the surface tension forces provided by molten solder to perform out-of-plane rotation of flexible hinges. Analysis is presented which indicates that the final angle of rotation can be controlled through initial solder volume, and that the forces are easily sufficient for the particular example of silicon micromechanical devices. However, the principle is general and could be applied to other materials.

引用

页码：662 / 664

页数：3