A NEW FULLY ADDITIVE FABRICATION PROCESS FOR PRINTED WIRING BOARDS

被引：8

作者：

AKAHOSHI, H ^{[1
]}

MURAKAMI, K ^{[1
]}

WAJIMA, M ^{[1
]}

KAWAKUBO, S ^{[1
]}

机构：

[1] HITACHI LTD,TOKAI WORKS,KATSUTA,IBARAKI 31912,JAPAN

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1986年 / 9卷 / 02期

关键词：

COPPER AND ALLOYS - ELECTROPLATING - LAMINATED PRODUCTS - Reliability - SURFACE PHENOMENA - Microscopic Examination;

D O I：

10.1109/TCHMT.1986.1136632

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The attainment of satisfactory performance levels using this additive manufacturing process is achieved by the development of a substrate and an accompanying metallization process having suitable properties. The process uses commercially available unclad laminates as base materials and includes the following steps: 1) coating and curing of adhesive on the base laminate, 2) drilling of holes, 3) roughening and catalyzing of the adhesive surface, 4) printing negative circuit patterns by screen printing, and 5) formation of conductive circuits by full-build electroless copper plating. Reliability of the through-hole interconnection was examined by thermal shock cycle tests. The peel strength between plated copper foils and substrate was measured before and after various soldering steps. Reliable high-performance printed wiring boards were fabricated with fewer processing steps than in conventional subtractive processes.

引用

页码：181 / 187

页数：7