学术探索
学术期刊
新闻热点
数据分析
智能评审

HIGH-TEMPERATURE INTERGRANULAR CRACK-GROWTH PROCESSES IN COPPER AND COPPER WITH 1 WT-PERCENT ANTIMONY

被引：18
作者：
EARTHMAN, JC
GIBELING, JC
NIX, WD
机构：
来源：
ACTA METALLURGICA | 1985年 / 33卷 / 05期
关键词：
D O I：
10.1016/0001-6160(85)90104-X
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
引用
收藏
页码：805 / 817
页数：13
相关论文
共 24 条
[1]  
Anctil AA, 1963, P ASTM, V63, P799
[2]  
BASSANI JL, 1980, J SOLIDS STRUCT, V17, P479
[3]  
GROSS B, 1964, NASA D2395 TECHN NOT
[4]   USE OF C-STAR PARAMETER IN PREDICTING CREEP CRACK-PROPAGATION RATES [J].
HARPER, MP ;
ELLISON, EG .
JOURNAL OF STRAIN ANALYSIS FOR ENGINEERING DESIGN, 1977, 12 (03) :167-179
[5]   THE ASYMPTOTIC STRESS AND STRAIN FIELD NEAR THE TIP OF A GROWING CRACK UNDER CREEP CONDITIONS [J].
HUI, CY ;
RIEDEL, H .
INTERNATIONAL JOURNAL OF FRACTURE, 1981, 17 (04) :409-425
[6]   CONSTITUTIVE BEHAVIOR AND CRACK TIP FIELDS FOR MATERIALS UNDERGOING CREEP-CONSTRAINED GRAIN-BOUNDARY CAVITATION [J].
HUTCHINSON, JW .
ACTA METALLURGICA, 1983, 31 (07) :1079-1088
[7]  
JOHNSON HH, 1965, MATER RES STANDARD, V5, P442
[8]  
KUMAR V, 1981, EPRI NP1931 REP
[9]  
Landes JD., 1976, ASTM SPECIAL TECHNIC, V590, P128
[10]  
LLOYD GJ, 1976, TRG2818R UK AT EN AU
123