CERAMIC AND GLASS-CERAMIC PACKAGING IN THE 1990S

被引:668
作者
TUMMALA, RR
机构
[1] Ibm Corporation, East Fishkill, New York
关键词
ceramics; computers; glass‐ceramics; packaging; semiconductors;
D O I
10.1111/j.1151-2916.1991.tb04320.x
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
A broad overview of packaging involving interconnecting, powering, protecting, and cooling semiconductor chips to meet a variety of computer system needs is presented. The general requirements for ceramics in terms of their thermal, mechanical, electrical, and dimensional control requirements are presented, both for high-performance and low-performance applications. Glass-ceramics are identified as the best candidates for high-performance systems, and aluminum nitride, alumina, or mullite are identified for low-performance systems. Glass-ceramic/copper substrate technology is discussed as an example of high-performance ceramic packaging for use in 1990s. Lower-dielectric-constant ceramics such as composites of silica, borosilicate, and cordierite, with or without polymers and porosity, are projected as potential ceramic substrate materials by the year 2000.
引用
收藏
页码:895 / 908
页数:14
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