IN SEARCH OF NEW LEAD-FREE ELECTRONIC SOLDERS

被引：188

作者：

WOOD, EP

NIMMO, KL

机构：

[1] Cookson Group plc, Cookson Technology Centre, Kidlington, 0X5 1PF, Oxfordshire, Sandy Lane, Yarnton

来源：

JOURNAL OF ELECTRONIC MATERIALS | 1994年 / 23卷 / 08期

关键词：

LEAD-FREE; MELTING POINT; OXIDATION; SOLDER;

D O I：

10.1007/BF02651363

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Tin-lead solder has been widely used in the electronics industry for many years. However, increasing environmental pressures, together with some technological issues, have now prompted great interest in finding a viable nonleaded substitute. This paper first summarizes some of the background issues, specifically availability, cost, and toxicity. It then outlines some of the work undertaken by Cookson Group plc on behalf of Alpha-Fry in searching for alloys with a narrow melting range between 135 and 183-degrees-C.

引用

页码：709 / 713

页数：5

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