MECHANICAL APPLICATIONS OF THIN AND THICK DIAMOND FILMS

被引:46
作者
MURAKAWA, M
TAKEUCHI, S
机构
[1] Nippon Institute of Technology, Saitama Prefecture, 345, 4-1 Gakuendai, Miyashiro-machi
关键词
D O I
10.1016/0257-8972(91)90083-9
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Several applications of thin and thick diamond films have been developed in our laboratory which enable us to exploit the well-known property of diamond, i.e. the highest hardness on earth. These applications include cutting inserts of either a coated (thin film) type or a brazed (thick film) type whose performance has been evaluated and compared with both conventional sintered and single-crystal diamond insert (tool) as well as tungsten carbide insert in cutting very-hard-to-turn materials such as a 18 wt.% Si aluminium alloy or a dispersion-strenthened aluminium alloy including 20 vol.% SiC whiskers. The performance test is extended to a precision turning operation of pure aluminium which requires a very good surface finish. Other applications of diamond film here have been found in antiabrasive tools; one is a dresser used for forming grinding wheels and another is a shearing tool for cutting very abrasive materials such as a polishing tape with a top SiC coating layer. Finally, the development of an indenter mounting a thick diamond film flake shaped into a scratch tester tip has been explained as one example of diamond films for use as various mechanical parts or elements.
引用
收藏
页码:359 / 365
页数:7
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