1.55-MU-M BURIED HETEROSTRUCTURE LASER VIA REGROWTH OF SEMIINSULATING INP-FE AROUND VERTICAL MESAS FABRICATED BY REACTIVE ION ETCHING USING METHANE AND HYDROGEN
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KJEBON, O
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机构:Swedish Institute of Microelectronics, Box 1084
KJEBON, O
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LOURDUDOSS, S
HAMMARLUND, B
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机构:Swedish Institute of Microelectronics, Box 1084
HAMMARLUND, B
LINDGREN, S
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机构:Swedish Institute of Microelectronics, Box 1084
LINDGREN, S
RASK, M
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机构:Swedish Institute of Microelectronics, Box 1084
RASK, M
OJALA, P
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机构:Swedish Institute of Microelectronics, Box 1084
OJALA, P
LANDGREN, G
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机构:Swedish Institute of Microelectronics, Box 1084
LANDGREN, G
BROBERG, B
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机构:Swedish Institute of Microelectronics, Box 1084
BROBERG, B
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[1] Swedish Institute of Microelectronics, Box 1084
A GaInAsP/InP Fabry-Perot-type buried-heterostructure quantum well laser operating at 1.55-mu-m has been realized utilizing iron-doped semi-insulating InP around vertical mesas fabricated by reactive ion etching using methane and hydrogen. A maximum cw output power of 19 mW has been achieved on as-cleaved chips of 300-mu-m length with a quantum efficiency of 21 % per facet. Threshold currents lie between 20 and 25 mA. As low as 2-OMEGA series resistance has been measured despite an ohmic contact area not exceeding that of the 2-mu-m-wide mesa. A 3 dB bandwidth of 7.5 GHz at 12 mW output power is obtained from the small-signal frequency modulation measurements.