MULTI-CHIP MODULE TEST AND DIAGNOSTIC METHODOLOGY

被引：7

作者：

CURTIN, JJ

WAICUKAUSKI, JA

机构：

来源：

IBM JOURNAL OF RESEARCH AND DEVELOPMENT | 1983年 / 27卷 / 01期

关键词：

D O I：

10.1147/rd.271.0027

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

引用

收藏

页码：27 / 34

页数：8

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