ELECTRICAL MODELING OF PACKAGING DISCONTINUITIES - A GENERAL METHODOLOGY BASED ON THE 3-DIMENSIONAL TLM CONCEPT

A general methodology for modeling packages using the three dimensional (3D) TLM method is presented. S parameters are calculated from reflected and transmitted signals, and electrical parameters of equivalent networks are extracted. Frequency domain results (up to 30 GHz) are presented for a microstrip right-angle bend, a cross junction, and vias. The purpose of this article is to demonstrate the possibilities of using the 3D TLM method for electrical modeling in packaging applications. (C) 1995 John Wiley & Sons, Inc.