KINETICS OF COPPER PASSIVATION AND PITTING CORROSION IN NA2SO4 CONTAINING DILUTE NAOH AQUEOUS-SOLUTION

被引：51

作者：

SOUTO, RM ^{[1
]}

GONZALEZ, S ^{[1
]}

SALVAREZZA, RC ^{[1
]}

ARVIA, AJ ^{[1
]}

机构：

[1] NATL UNIV LA PLATA, INIFTA, RA-1900 LA PLATA, ARGENTINA

来源：

ELECTROCHIMICA ACTA | 1994年 / 39卷 / 17期

关键词：

COPPER; COPPER PASSIVATION; PITTING CORROSION; SULFATE SOLUTIONS; NUCLEATION; GROWTH PROCESSES;

D O I：

10.1016/0013-4686(94)00204-5

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

The electrochemical behaviour of Cu in alkaline solutions containing Na2SO4 was studied using potentiodynamic and potentiostatic techniques complemented by scanning electron microscopy. The presence of Na2SO4 enhances Cu electrodissolution through the passive layer and decreases the breakdown potential. There is a critical OH-/sulphate concentration ratio for the onset of localized corrosion. The competitive interaction between OH- and sulphate ions at the passive layer can explain the experimental data. Pit initiation fits the point defect model for passivity breakdown. Pit growth involves a number of current contributions which can be distinguished through the analysis of current transients at constant potential by using nucleation and growth models.

引用

页码：2619 / 2628

页数：10

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