THERMODYNAMIC PROPERTIES AND TRANSPORT-COEFFICIENTS IN SF(6)-CU MIXTURES AT TEMPERATURES OF 300-30000-K AND PRESSURES OF 0.1-1-MPA

The thermodynamic properties and the transport coefficients of thermal plasmas formed in SF6-copper vapour mixtures were calculated as a function of temperature and pressure for molar concentrations of copper between 0 and 10%. The material property that is most affected by the presence of copper is the electrical conductivity for temperatures up to 10000 K. The results given in this paper enabled a data bank to be built up for modelling arcs in SF6 seeded with copper vapour.