THE CHEMISTRY OF THE ADDITIVES IN AN ACID COPPER ELECTROPLATING BATH .3. THE MECHANISM OF BRIGHTENING BY 4,5-DITHIAOCTANE-1,8-DISULFONIC ACID

被引：51

作者：

HEALY, JP ^{[1
]}

PLETCHER, D ^{[1
]}

GOODENOUGH, M ^{[1
]}

机构：

[1] LEARONAL LTD,HIGH PEAK LABS,BUXTON SK15 9SS,DERBY,ENGLAND

来源：

JOURNAL OF ELECTROANALYTICAL CHEMISTRY | 1992年 / 338卷 / 1-2期

关键词：

D O I：

10.1016/0022-0728(92)80422-Z

中图分类号：

O65 [分析化学];

学科分类号：

070302 ; 081704 ;

摘要：

The focus of attention now shifts to the mechanisms by which 4,5-dithiaoctane-1,8-disulphonic acid, [SCH2CH2CH2CH2SO3H]2, influences the operation of commercial acid copper electroplating baths. It is shown that, although this additive does not affect the rate of deposition of copper, it does have electrochemistry within the potential range where copper deposition occurs. Potential sweep, potential step and rotating disc techniques have been used to define these electrode reactions and it is concluded that an insoluble Cu(I) complex on the copper surface is a key intermediate leading to brightening.

引用

页码：179 / 187

页数：9

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