MONITORING SINTERING DENSIFICATION AND CRYSTALLIZATION GRAIN-GROWTH IN TL-BASED HIGH-TEMPERATURE SUPERCONDUCTORS BY ELECTRICAL-CONDUCTIVITY MEASUREMENTS

被引:15
作者
RATTO, JJ [1 ]
PORTER, JR [1 ]
HOUSLEY, RM [1 ]
MORGAN, PED [1 ]
机构
[1] CALTECH,PASADENA,CA 91125
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 1990年 / 29卷 / 02期
关键词
Electrical resistance method; Four point probe method; Grain-growth; High temperature superconductor; Intergrowths; Sintering; Syntactic; TI-Ba-Ca-Cu-0; Tl-2201; Tl-2212; Tl-2223;
D O I
10.1143/JJAP.29.244
中图分类号
O59 [应用物理学];
学科分类号
摘要
An “in situ” electrical resistance method has been used to monitor sintering to best achieve a high percentage of Tl-2223 structure. By this means, the sequential formation of syntactic intergrowths, 2201, 2212 and 2223 structures, was followed as a function of temperature, time, seeding and gaseous atmosphere. At 895°C, slight melting assists the formation of ∼95% pure 2223; the presence of carbonate is probably deleterious. © 1990 The Japan Society of Applied Physics.
引用
收藏
页码:244 / 251
页数:8
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