COPPER POLYIMIDE MATERIALS SYSTEM FOR HIGH-PERFORMANCE PACKAGING

被引：91

作者：

JENSEN, RJ ^{[1
]}

CUMMINGS, JP ^{[1
]}

VORA, H ^{[1
]}

机构：

[1] HONEYWELL INC,DIV SOLID STATE ELECTR,PLYMOUTH,MN

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1984年 / 7卷 / 04期

关键词：

D O I：

10.1109/TCHMT.1984.1136378

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：384 / 393

页数：10

共 19 条

[1] BODGETT AJ, 1980, P ELECTRONIC COMPONE, P283
[2] BUPP JR, 1982, IBM J RES DEV, V10, P306
[3] Cummings J. P., 1982, Proceedings of the 32nd Electronic Components Conference, P465
[4] ELECTRICAL DESIGN OF A HIGH-SPEED COMPUTER PACKAGE
DAVIDSON, EE
[J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1982, 26 (03) : 349 - 361
[5] ECKER ME, 1981, P INT SOC HYBRID MIC, V4, P251
[6] Goldberg N, 1981, P ISHM, V4, P289
[7] MEASUREMENT OF STRESSES GENERATED IN CURED POLYIMIDE FILMS
GOLDSMITH, C
GELDERMANS, P
BEDETTI, F
WALKER, GA
[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1983, 1 (02): : 407 - 409
[8] THE THIN-FILM MODULE AS A HIGH-PERFORMANCE SEMICONDUCTOR PACKAGE
HO, CW
CHANCE, DA
BAJOREK, CH
ACOSTA, RE
[J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1982, 26 (03) : 286 - 296
[9] Lebow S., 1980, Proceedings of the 30th Electronic Components Conference, P307
[10] Maissel L. I., 1970, HDB THIN FILM TECHNO, P22