MICROSTRUCTURE TRENDS IN METAL(ALUMINUM, COPPER, INDIUM, LEAD, TIN)-METAL OXIDE THIN-FILMS PREPARED BY REACTIVE ION-BEAM SPUTTER DEPOSITION

被引：15

作者：

NAKAHARA, S

HEBARD, AF

机构：

来源：

THIN SOLID FILMS | 1983年 / 102卷 / 04期

关键词：

D O I：

10.1016/0040-6090(83)90051-2

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：345 / 360

页数：16

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