THERMAL FATIGUE LIFE PREDICTION OF FLIP-CHIP SOLDER JOINTS BY FRACTURE-MECHANICS METHOD

被引：23

作者：

LAU, JH

机构：

[1] Hewlett-Packard Company, Palo Alto, CA 94303

来源：

ENGINEERING FRACTURE MECHANICS | 1993年 / 45卷 / 05期

关键词：

D O I：

10.1016/0013-7944(93)90270-3

中图分类号：

O3 [力学];

学科分类号：

08 ; 0801 ;

摘要：

The J-integral and stress intensity factor around the crack tips of a self-stretching flip chip solder joint under thermal fatigue crack propagation are determined by the finite element method. A 5th order polynomial is used to best fit the J-integral and stress intensity factor as a function of the crack length in the solder joint. Thermal fatigue life of the solder joint is then estimated based on the calculated J-integral and stress intensity factor, Paris' law, and fatigue crack growth rate data on solders. A correlation between the analytical and experimental results is made.

引用

页码：643 / &

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