KINETIC-STUDY IN A MICROWAVE-INDUCED PLASMA AFTERGLOW OF THE CU(4(2)S) ATOM REACTION WITH N2O FROM 458-K TO 980-K AND WITH NO2 FROM 303-K TO 762-K

The rate constants for the reaction of ground-state copper atoms (4 2S) with N2O and NO2 have been derived in a fast-flow reactor. The microwave-induced plasma (MIP) afterglow technique was used for the generation of copper atoms in the gas phase. The rate constant for the reaction Cu(4 2S) + N2O --> CuO + N2 at temperatures between 458 and 980 K is found to be (2.4 +/- 0.6) x 10(-10) exp - (48.6 +/- 1.4 kJ mol-1/RT) cm3 molecule-1 s-1. The reaction Cu(4 2S) + NO2 --> products, was followed in the temperature range from 303 to 762 K and has a rate constant (1.3 +/- 0.6) x 10(-11) exp - (0.2 +/- 1.3 kJ mol-1/RT) cm3 molecule-1 s-1. From the copper atom decays in argon at 528 K, a diffusion coefficient, D(Cu, Ar) = 543.2 +/- 60.2 cm2 Torr s-1, could be derived.