OUT-OF-PLANE THERMAL-EXPANSION COEFFICIENT OF BIPHENYLDIANHYDRIDE-PHENYLENEDIAMINE POLYIMIDE FILM

被引：21

作者：

CHEN, ST ^{[1
]}

WAGNER, HH ^{[1
]}

机构：

[1] IBM CORP,GERMAN MFG TECHNOL CTR,SINDELFINGEN,GERMANY

来源：

JOURNAL OF ELECTRONIC MATERIALS | 1993年 / 22卷 / 07期

关键词：

LASER SPOT SCANNING INTERFEROMETER; POLYIMIDE FILM; THERMAL EXPANSION COEFFICIENT;

D O I：

10.1007/BF02817357

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The out-of-plane thermal expansion coefficient alpha(perpendicular-to) of biphenyldianhydride-phenylenediamine (BPDA-PDA) polyimide thin film between 20 and 400-degrees-C has been measured using a laser spot scanning interferometer. The alpha(perpendicular-to) varies from 100 ppm/-degrees-C at 20-degrees-C to 400 ppm/-degrees-C at 400-degrees-C. As the result of highly anisotropic microstructure, the alpha(perpendicular-to) is much larger than the in-plane thermal expansion coefficient alpha(parallel-to) and increases dramatically when the temperature exceeds the glass transition temperature (approximately 320-degrees-C).

引用

页码：797 / 799

页数：3

共 12 条

[1]

BOESE D, 1991, MATER RES SOC SYMP P, V227, P379, DOI 10.1557/PROC-227-379

[2]

CHEN SH, UNPUB

[3] LARGE ANISOTROPY IN OPTICAL-PROPERTIES OF THIN POLYIMIDE FILMS OF POLY(P-PHENYLENE BIPHENYLTETRACARBOXIMIDE) [J].