THE COMPOSITION AND MICROSTRUCTURE OF ELECTRODEPOSITED SOLDER ON ELECTROLESS NICKEL IN THE PRESENCE OF GELATIN

被引：4

作者：

LIN, KL

CHANG, JT

机构：

[1] Department of Materials Science and Engineering (29), National Cheng Kung University, Tainan

来源：

JOURNAL OF MATERIALS SCIENCE | 1995年 / 30卷 / 07期

关键词：

D O I：

10.1007/BF00351625

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The effect of gelatine addition to the electrodeposition bath on the tin content of the solder deposits was investigated. The results showed that as little as 0.5 gl(-1) gelatine greatly enhanced the tin content of the deposits. The maximum tin content achievable for the deposit was approximately equal to the percentage of tin in the deposition bath. A lower current density and a greater metal content of the deposition bath tended to offset the effect of gelatine in promoting tin content of the deposit. Gelatine was found, with the aid of scanning electron microscopy and X-ray diffractometry, strongly to affect the morphology and facet orientation of the deposits.

引用

页码：1879 / 1883

页数：5

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