COMPUTER-SIMULATION STUDY OF GRAIN-BOUNDARY AND TRIPLE JUNCTION DISTRIBUTIONS IN MICROSTRUCTURES FORMED BY MULTIPLE TWINNING

被引：54

作者：

GERTSMAN, VY ^{[1
]}

TANGRI, K ^{[1
]}

机构：

[1] RUSSIAN ACAD SCI, INST MET SUPERPLAST PROBLEMS, UFA 450001, RUSSIA

来源：

ACTA METALLURGICA ET MATERIALIA | 1995年 / 43卷 / 06期

关键词：

D O I：

10.1016/0956-7151(94)00422-6

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Microstructures formed as a result of multiple twinning have been simulated by means of computer modelling. Grain boundary misorientation (character) and triple junction distributions have been studied with the emphasis on the effect of initial texture and multiple twinning process. Although grain boundary distributions are similar in all the microstructures modelled, sharp initial texture leads to a somewhat enhanced amount of Sigma 3 boundaries and to a considerable increase in the number of triple junctions containing two Sigma 3 boundaries. The impact of these parameters on the material susceptibility to intergranular crack propagation has been analysed and implications for grain boundary engineering has been discussed.

引用

页码：2317 / 2324

页数：8

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