SOLDERING DETERIORATION OF EPOXY-MOLDED IC PACKAGES AFTER MOISTURE ABSORPTION

被引：18

作者：

ASAI, S ^{[1
]}

SARUTA, U ^{[1
]}

TOBITA, M ^{[1
]}

机构：

[1] DENKA KAKO KK,OJIMA FACTORY,GUNMMA 372,JAPAN

来源：

JOURNAL OF APPLIED POLYMER SCIENCE | 1994年 / 51卷 / 11期

关键词：

Curing - Integrated circuit manufacture - Phenolic resins - Physical properties - Soldering;

D O I：

10.1002/app.1994.070511111

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

Molding compounds for surface-mount devices were studied by using various kinds of epoxy resins in a practical model compound with phenol resins as curing agents. The physical properties of the cured compounds were studied at 215-degrees-C to simulate the condition that they encounter during the soldering process that can relate to package cracks. The compounds that have low modulus at soldering temperature, low equilibrium water concentration, and good adhesion toward the die pad developed few cracks after soldering. The compounds from difunctional epoxy resins showed good durability, resisting this phenomenon. (C) 1994 John Wiley & Sons, Inc.

引用

页码：1945 / 1958

页数：14

共 10 条

[1] EFFECT OF TIME-TEMPERATURE PATH OF CURE ON THE WATER-ABSORPTION OF HIGH TG EPOXY-RESINS [J].