PERFORMANCE OF JOSEPHSON ARRAY SYSTEMS RELATED TO FABRICATION TECHNIQUES AND DESIGN

被引：15

作者：

MULLER, F

KOHLMANN, J

HEBRANK, FX

WEIMANN, T

WOLF, H

NIEMEYER, J

机构：

[1] Physikalisch-Technische Bundesanstalt

来源：

IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY | 1995年 / 5卷 / 02期

关键词：

D O I：

10.1109/77.403199

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Arrays of Nb/AlOx/Nb Josephson tunnel junctions show de characteristics of high quality when the trilayer is deposited direct on polished Si wafers. Underlayers such as rf-sputtered SiO2, can considerably degrade the junction parameters. These results suggest that voltage standard chips should be produced with a cover instead of a groundplane. First results of attenuation measurements on such circuits are presented and discussed. Furthermore, a new and more simple fabrication process without a window-insulating layer and only two photolithographic steps is presented. Arrays of several thousands of junctions showed no problems of any kind with trappped flux.

引用

页码：2903 / 2906

页数：4

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