FLIP-CHIP SOLDER BOND MOUNTING OF LASER-DIODES

被引：17

作者：

EDGE, C

ASH, RM

JONES, CG

GOODWIN, MJ

机构：

[1] Plessey Research Caswell Limited, Caswell, Towcester

来源：

ELECTRONICS LETTERS | 1991年 / 27卷 / 06期

关键词：

SEMICONDUCTOR LASERS; DIODES;

D O I：

10.1049/el:19910314

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The successful hybrid mounting of semiconductor laser diode chips by flip-chip solder bonding is reported. This technique allows accurate chip placement with submicron positioning, and has demonstrated acceptable heat dissipation characteristics.

引用

页码：499 / 501

页数：3