A VAPOUR ETCHING TECHNIQUE FOR PHOTOLITHOGRAPHY OF SILICON DIOXIDE

被引：60

作者：

HOLMES, PJ

SNELL, JE

机构：

来源：

关键词：

D O I：

10.1016/0026-2714(66)90162-4

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：337 / &

共 7 条

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[2] ILLIARONOV VV, 1963, ZH PRIKL KHIM, V36, P237
[3] KHAIDUKOV N, 1936, J APPLIED CHEM, V9, P439
[4] PARTIAL PRESSURE MEASUREMENTS ON THE SYSTEM HYDROGEN FLUORIDE WATER
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[J]. INDUSTRIAL AND ENGINEERING CHEMISTRY, 1949, 41 (07): : 1504 - 1508
[5] HYDROFLUORIC ACID WATER AND HYDROFLUORIC ACID HYDROFLUOSILICIC ACID WATER
MUNTER, PA
AEPLI, OT
KOSSATZ, RA
[J]. INDUSTRIAL AND ENGINEERING CHEMISTRY, 1947, 39 (03): : 427 - 430
[6] HIGH-SILICA FLUOSILICIC ACIDS - SPECIFIC REACTIONS AND THE EQUILIBRIUM WITH SILICA
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[J]. JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, 1952, 74 (07) : 1690 - 1693
[7] WHYNES AL, 1956, T I CHEM ENG-LOND, V34, P117