CAPACITIVE MICROPHONE WITH A SURFACE MICROMACHINED BACKPLATE USING ELECTROPLATING TECHNOLOGY

被引：45

作者：

BERGQVIST, J ^{[1
]}

GOBET, J ^{[1
]}

机构：

[1] CTR SUISSE ELECTR & MICROTECH SA,CH-2007 NEUCHATEL,SWITZERLAND

来源：

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS | 1994年 / 3卷 / 02期

关键词：

D O I：

10.1109/84.294323

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A technology for surface micromachining of freestanding metal microstructures using metal electrodeposition on a sacrificial photoresist layer has been applied to a condenser microphone. Electroplating technology has been used to implement a suspended and perforated 15-mu m-thick microstructure in copper, which serves as backplate electrode in the condenser microphone. The 1.8 x 1.8 mm(2) large microphone diaphragm is in monocrystalline silicon and is fabricated with anisotropic etching of the substrate wafer. The realized prototypes have a measured sensitivity of 1.4 mV/Pa using a bias voltage of 28 V. The bandwidth is limited by an anti-resonance at 14 kHz which is due to the semi-rigid backplate. The resonance behavior of the backplate structure has been analyzed with finite element modeling with results in good agreement with measured data. [91]

引用

页码：69 / 75

页数：7

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