THE STRENGTH OF BRASS/SN-PB-SB SOLDER JOINTS CONTAINING 0 TO 10-PERCENT-SB

被引：24

作者：

TOMLINSON, WJ

BRYAN, NJ

机构：

[1] Coventry Polytechnic, Dep of, Materials, Coventry, Engl, Coventry Polytechnic, Dep of Materials, Coventry, Engl

来源：

JOURNAL OF MATERIALS SCIENCE | 1986年 / 21卷 / 01期

关键词：

METALLOGRAPHY - Diffusion - SOLDERS - Testing - TIN LEAD ANTIMONY ALLOYS - Applications;

D O I：

10.1007/BF01144706

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The strength of brass/Sn-Pb-Sb solder joints has been determined for solders containing 0 to 10%Sb and the fracture process examined by microscopial techniques. Intermetallic formation by interdiffusion in the Cu-Zn/Sn-Sb and Cu-Zn/Pb-Sb systems were also investigated. Additions of up to 10%Sb in the solder reduce the shear strength by only 10%, but cause the joint to have a variable and occasionally very low fatigue resistance.

引用

页码：103 / 109

页数：7

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