LED ARRAY MODULES BY NEW TECHNOLOGY MICROBUMP BONDING METHOD

被引：27

作者：

HATADA, K

FUJIMOTO, H

OCHI, T

ISHIDA, Y

机构：

[1] VLSI Technology Research Laboratory, Semiconductor Research Center, Matsushita Electric Industrial Co., Ltd., Moriguchi, Osaka

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1990年 / 13卷 / 03期

关键词：

D O I：

10.1109/33.58854

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

An LED array module was developed by employing the microbump bonding method [1]-[4] by which the electrodes of LSI chips and circuit substrate are press-bonded by utilizing the shrinkage stress produced in a light setting insulating resin. The developed LED array module has a resolution of 400 DPI, and is constructed by face down mounting of 54 each of the LED chips and driver LSI’s on a glass substrate. These LED chips, having an electrode pitch of 63.5 μm, are disposed on the glass substrate at a pitch of 10 μm. A dedicated bonder was developed for this assembling work. This paper reports on the LED array module assembling process and the construction of a developed bonder. © 1990 IEEE

引用

页码：521 / 527

页数：7