CRACK-GROWTH AND DAMAGE IN CONSTRAINED SINTERING FILMS

The constrained sintering of films on substrates leads to a reduction in densification rate and may lead to processing flaws. This paper reports on a study of damage and cracking in sintering films, with particular emphasis on the growth of preexisting cracks. Experiments have been conducted with glass and polycrystalline Al2O3 films on various substrates. The effect of important variables (viz., film thickness, crack length, and friction with the substrate) on crack growth is reported. The experiments with glass films show that cracking occurs above a critical film thickness which is in good quantitative agreement with a recent analysis for this problem. In the case of Al2O3 films, we observe a diffuse damage zone ahead of cracks. Crack growth occurs by the coalescence of microcracks with each other and with the main crack. Some possible reasons for this difference between the glass and Al2O3 films are presented. As a model for diffuse damage, the stability of a sintering film under spatial variations in constitutive parameters is analyzed. It is shown that the film is unstable to small perturbations only in the early stages of densification, and that for viscous sintering the films are usually kinetically stable.