GRAIN-BOUNDARY INTERDIFFUSION IN CD/TE THIN-FILM COUPLES

被引:6
作者
JADIN, A
ANDREW, R
WAUTELET, M
DUMONT, B
LAUDE, LD
机构
关键词
D O I
10.1016/0040-6090(87)90154-4
中图分类号
T [工业技术];
学科分类号
08 ;
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页码:163 / 169
页数:7
相关论文
共 4 条
[1]   MEASUREMENT OF GRAIN-BOUNDARY DIFFUSION AT LOW-TEMPERATURES BY THE SURFACE ACCUMULATION METHOD .1. METHOD AND ANALYSIS [J].
HWANG, JCM ;
BALLUFFI, RW .
JOURNAL OF APPLIED PHYSICS, 1979, 50 (03) :1339-1348
[2]  
Martin G., 1980, GRAIN BOUND STRUCT K, P239
[3]  
WAUTELET M, 1982, COHESIVES PROPERTIES, P483
[4]  
ZANIO K, 1978, SEMICONDUCTORS SEMIM, V13