CORRELATION OF THE YIELD STRENGTH AND MICROHARDNESS OF HIGH-STRENGTH, HIGH-CONDUCTIVITY COPPER-ALLOYS

被引:18
作者
ZINKLE, SJ
PLANTZ, DH
BAIR, AE
DODD, RA
KULCINSKI, GL
机构
[1] Univ of Wisconsin-Madison, Fusion, Technology Inst, Madison, WI, USA, Univ of Wisconsin-Madison, Fusion Technology Inst, Madison, WI, USA
关键词
The authors gratefully acknowledge the assistanceo f N.F. Panayotou during the course of this investigation. We would like to thank A.R. Graviano of AMAX Copper; Inc. for supplying the copper foils and H.L. Heinisch for performing the digital data analysis of the tensile specimens. Some of this work (S.J.Z.) was performed under appointment to the Magnetic Fusion Energy Technology Fellowship Program and (A.E.B.) with funds supplied by the US Department of Energy under contract DE-lAM06-76-RL02225 (NORCUS Fellowship Program);
D O I
10.1016/0022-3115(85)90236-3
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
24
引用
收藏
页码:685 / 689
页数:5
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