CU PHOTOSENSITIVE-BCB THIN-FILM MULTILAYER TECHNOLOGY FOR HIGH-PERFORMANCE MULTICHIP MODULES

被引：12

作者：

SHIMOTO, T

MATSUI, K

UTSUMI, K

机构：

[1] The authors are with the Material Development Center, NEC Corporation, Kawasaki-city, Kanagawa

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 1995年 / 18卷 / 01期

关键词：

MULTICHIP MODULE; MCM-D; BENZOCYCLOBUTENE; PHOTOSENSITIVE; RISC MODULE;

D O I：

10.1109/96.365476

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A new MCM-D technology which enables reliable fabrication of high-performance and low cost MCM's has been developed. The technology is based on Cu/Photosensitive-BCB thin-film multilayer structure. The fabrication process is reduced by using the newly developed Photosensitive-BCB, with a conventional photolithography process. The flexibility on design rules is allowed, because the Cu/BCB structure has the advantages of excellent planarization and low electrical resistance of signal line. The following long-term reliability tests were successfully done: thermal cycle (-45 degrees C/125 degrees C), high-temperature aging at 125 degrees C, and high-temperature /humidity (85 degrees C/85%). A prototype of the high density RISC module fabricated with the developed technology passed all the long-term reliability tests, The excellent electrical performance was also proved through the signal transmission tests with the prototype module.

引用

页码：18 / 22

页数：5