A MICROMACHINED ARRAY PROBE CARD - CHARACTERIZATION

被引：47

作者：

BEILEY, M ^{[1
]}

LEUNG, J ^{[1
]}

WONG, SS ^{[1
]}

机构：

[1] IBM CORP,MICROELECTR,ESSEX JCT,VT 05452

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 1995年 / 18卷 / 01期

关键词：

D O I：

10.1109/96.365507

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

An array probe card fabricated on a silicon wafer for high performance and high pin count applications is characterized, The probe card is capable of providing a very large number of probe tips (> 1000) that offer a contact resistance of less than 2 Omega, A novel approach to replacing the mechanical scrubbing motion with an electrical breakdown process is presented. The probe card is capable of operating at elevated temperatures for extended periods of time, offers alternative probe tip configurations, and is capable of probing a variety of pad metals, Controlled impedance (50 Omega) striplines that run all the way to the probe tips offer a delay time of 68 ps/cm, 3 GHz bandwidth, and far-end cross-talk of -49 dB/cm at a pitch of 32 mu m.

引用

页码：184 / 191

页数：8