Mode-I fracture behaviour of adhesive joints .1. Relationship between fracture energy and bond thickness

被引:43
作者
Daghyani, HR [1 ]
Ye, L [1 ]
Mai, YW [1 ]
机构
[1] UNIV SYDNEY,DEPT MECH & MECHATRON ENGN,CTR ADV MAT TECHNOL,SYDNEY,NSW 2006,AUSTRALIA
关键词
adhesive joints; bond thickness; mode-I fracture toughness; finite element analysis; epoxy resin; fractography;
D O I
10.1080/00218469508009935
中图分类号
TQ [化学工业];
学科分类号
0817 ;
摘要
The fracture properties of adhesive joints of aluminium were investigated using a rubber-modified tough epoxy resin system (G(IC) = 2.76 kJ/m(2)) as adhesive material. Compact tension (CT) adhesive joints were manufactured for a wide range of bond thickness t (from 0.05 mm to 10 mm) and fracture tests conducted under static load. Scanning electron microscopy (SEM) was used to examine the fracture surface morphology. A large deformation elastic- plastic finite element model was developed to evaluate the J-integral value for different bond thickness. The fracture energy, J(C), was found to be highly dependent on the bond thickness and was lower than that of the bulk adhesive. As the bond thickness was increased J(C) also increased, though not monotonically, towards the fracture energy of the bulk adhesive. This result was caused by the complicated interactions between the stress and strain fields, plastic deformation of the adhesive around the crack tip, constraint from the adherends and the failure path. It was shown that values of J(C) as a function of bond thickness correlated well with the variation of plastic zone height. Scanning electron micrographs from the fracture surfaces of the CT adhesive joints illustrated that the failure path was mainly cohesive through the centre-plane of the adhesive layer. Brittle fracture mechanisms were observed for thin bonds (0.04 mm < t < 0.5 mm) but tough fracture mechanisms were identified for thick bonds (t > 1 mm).
引用
收藏
页码:149 / 162
页数:14
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