VLSI PACKAGING TECHNIQUE USING LIQUID-COOLED CHANNELS

被引：47

作者：

KISHIMOTO, T ^{[1
]}

OHSAKI, T ^{[1
]}

机构：

[1] NIPPON TELEGRAPH & TEL PUBL CORP, MUSASHINO ELECT COMMUN LAB, MUSASHINO, TOKYO 180, JAPAN

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1986年 / 9卷 / 04期

关键词：

COMPUTER SIMULATION - ELECTRONICS PACKAGING - Cooling - FLOW OF FLUIDS - Mathematical Models - HEAT TRANSFER;

D O I：

10.1109/TCHMT.1986.1136661

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A new packaging technique which employs innovative indirect liquid cooling is described. The technique involves mounting very large-scale integrated (VLSI) chips on a multilayered alumina substrate which incorporates very fine coolant channels. In particular, an investigation into the optimal structure for the cooling section by computer simulation and by experiment involving the physical implementation of this structure is discussed. The numerical solution of the coolant flow distribution obtained ensures that the coolant distributor and collector structure dimensions can be determined to meet the uniform velocity distribution condition.

引用

页码：328 / 335

页数：8